Single-Photon-Level sCMOS Camera;The Aries 6504 Pro is built on a next-generation back-illuminated sCMOS platform, delivering substantial improvements in readout noise, frame ...
The Gemini 8KTDI is a new-generation TDI camera developed by Tucsen to address the challenging inspection. The Gemini not only offers outstanding sensitivity in the UV range but...
The Libra 5514 is a high-throughput scientific CMOS camera designed for demanding imaging systems that require both large field of view and high frame rates. Built around a back...
It incorporates Sony’s latest back-illuminated CMOS detector and combines advanced cooling sealing technology and image noise reduction technology from Tucsen. While achieving...
The Dhyana 400BSI V3 is undoubtedly the best camera featuring the Gpixel Gsense2020BSI sensor. It is designed for seamless integration, fits easily into small spaces, uses...
The Dhyana 95 V2 is designed to deliver ultimate sensitivity achieving similar results to EMCCD cameras while outperforming its contemporaries in specifications and price. Following...
The Dhyana XV are a series of fully in-vacuum, high-speed, cooled sCMOS cameras which utilize various back-illuminated sensors without anti-reflection coating for soft X-ray and...
The Libra UV is Tucsen’s UV-sensitive global shutter CMOS camera designed for high-speed, high-resolution inspection in the semiconductor industry. It has been successfully...
The Model 765 fast pulse and delay generator delivers 2 or 4 independent channels at up to 800 MHz. Rise and fall time stays below 70 ps (20% to 80%), with 10 ps resolution on...
The Model 745T pulse and delay generator delivers 250 fs delay resolution across four independent channels, with an optional four auxiliary channels. RMS jitter runs 5 ps plus...
The Model 588B rackmount pulse generator delivers high-density timing in one chassis. Choose twelve channels in 1U or twenty-four in 2U, with up to thirty-six independent outputs...
G1179-0460WNA is a 460W 1+1 2U redundant power solution for servers, storage, edge computing and communication infrastructure. It supports multi-rail outputs including 12V, 5V...
GW-NHP350SW-3.3 is a slim semi-potted industrial power supply delivering 3.3V at up to 60A with 198W rated output. It supports 90–264VAC or 127–370VDC input, active...
GW-GSP350W-36 is an enclosed industrial AC-DC power supply providing approximately 349W at 36V and 9.7A. It supports 90–264VAC input, active PFC and up to 92% efficiency...
The heart of advanced packaging is combining best-in-class components despite differing processes, nodes, materials, and sources. Heterogeneous 2.5D/3D ICs integrate elements ...
Hybrid bonding permanently bonds the surfaces of two wafers, dies, and/or chiplets, combining two distinct types of bonds: a dielectric-to-dielectric covalent bond and a metal...
Our Foundry 2.0 business model begins with wafers, dies, and chiplets sourced from traditional high-volume semiconductor foundries. These building blocks are combined, modified...
