Optics

Credit: M. King/NIST
NIST scientist Nikolai Klimov holds a PIC with tweezers.
A new photonic chip packaging approach may open the door to applications where conventional photonic packaging simply can’t survive—such as space missions, nuclear environments...
April 8, 2026
© Endeavor Business Media
1775587262693
Following the Photons: A Photonics Podcast
April 7, 2026
Credit: TDK Ventures
FIGURE 1. Evolution of AI data center scale-up cluster size.
April 7, 2026
Credit: Pacific Optica
A moment of focus in the Smith Lab: perfecting a prototype SAM-integrated multiphoton imaging system for the next leap in imaging technology.
April 3, 2026
Credit: Comptek Solutions
FIGURE 1. Passivation-enabled process decoupling in laser diode manufacturing. Cleaving in air is decoupled from passivation, and passivation decouples mirror coatings. Both safe windows reduce time pressure while maintaining oxidation-inert facets, which enables predictable downstream coatings, burn-in, and final test.
April 2, 2026
System-level optimization in AR glasses requires balancing optical performance, power consumption, and form factor across integrated display and waveguide architectures.
April 1, 2026
© Endeavor Business Media
1774984589258
Following the Photons: A Photonics Podcast
March 31, 2026
Credit: Eslam M.B. Fahmy
FIGURE 1. A chip containing arrays of NRSEL microlasers during the fabrication process.
March 30, 2026
© Endeavor Business Media
1774446882303
Following the Photons: A Photonics Podcast
March 25, 2026

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