A line of photo sensors comes in 3 mm, 5 mm, metal can, and ceramic packages with clear glass and plastic
lenses. Visible emitters are available in red (660 nm), amber (590 nm), green (520 nm), blue (465 nm), and white (x = 0.31, y = 0.32). Applications include electronic design, wireless communications, position sensing, and machine vision.
Marktech Optoelectronics
Latham, NY
[email protected]
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PRESS RELEASE
Marktech Photo Sensors & Custom Assemblies Address Complex Optoelectronic Applications
Latham, New York: Marktech Optoelectronics, a leader in the design, development and sales of optoelectronic components, has added a complete line of high quality Photo Sensor devices to their Optoelectronic component line-up. Specializing in metal can and precision epoxy packages, Marktech has added unique package styles, materials and custom capabilities to their LED line. Marktech also offers many standard configurations and lens options as well as custom designs and assemblies not available from competitors. With over 25 years of experience in the optoelectronics industry, Marktech’s engineering group can provide concrete solutions for some of the most difficult sensor applications. Photo Sensors have become an ever growing part of electronic designs, from infrared remote controls and wireless communications to position sensing and machine vision. High quality emitter and detector products have become a necessity in the telecommunications, automotive, industrial and medical industries.
Photo Sensor Features
3mm, 5mm, Metal Can and Ceramic Packages
Wide range of power output
Visible Emitters available in Red(660nm), Amber (590nm), Green (520nm), Blue (465nm) and White (x=0.31, y=0.32)
Water Clear Glass & Plastic Lens
High Efficiency & Reliability
Precise Optical & Mechanical Accuracy
Exceptional Cost vs. Performance Ratio
Custom Assembly Options
Marktech has the capability to produce custom sensor devices in a wide variety of package styles and wavelengths to create the ideal sensor module for your specific application. From single chip to nine chip components, Marktech can build custom parts to meet the specific needs of almost any sensor application. Marktech’s applications and technical engineering staff can assist you in choosing the best combination of die and package type to build devices that are matched to your application specifications. From prototyping and design to custom assemblies and testing, we have the experience necessary to bring a concept through to production
For a copy of our latest Photo Sensor product guide or to find out more about our custom assembly options contact Marktech Optoelectronics at 800.984.5337 or [email protected], or visit our website at www.marktechopto.com for specs and additional information.