One-component adhesive system formulated for “side bonding” applications
The LED415DC90 one-component adhesive system cures rapidly upon exposure to LED light at 405 nm, followed by heat curing at 90°–95°C for 30-45 min. This fast-curing system is not oxygen-inhibited and can cure up to 6 mm deep or in cross-section. This unusual curing profile is formulated for “side bonding” applications.
Master Bond
Hackensack, NJ