LED curing adhesive system withstands thermal cycling
The LED405FL3 flexible one-component, LED curing adhesive system offers high optical clarity and a refractive index of 1.51. This no-mix system cures upon exposure to a 405 nm LED light source. Serviceable from -100° to 250°F, it withstands thermal cycling and allows for stress minimization when bonding substrates with different coefficients of thermal expansion.
Master Bond
Hackensack, NJ