Laser drilling system has use in fcBGA packaging
The ESI Geode A laser drilling system combines an innovative CO2 laser and optics configuration with precision pulse shaping and beam steering designed for ABF materials. It provides processing and application solutions for the flip-chip ball-grid array (fcBGA) package substrate market. fcBGA substrates enable supercomputing, AI processing, autonomous cars, and other complex semiconductor modules.
MKS ESI
Beaverton, OR