The DIVIDOS laser depaneling system from InnoLas Solutions (Krailling, Germany) meets all the requirements in laser depaneling of rigid, ridge-flex, and flexible printed circuit boards (PCBs). In its FULL CUT mode, the system reportedly can produce up to 30% efficiency gains on PCB separation compared to other depaneling systems. The laser, which operates without physical contact and is subject to almost no wear, results in extremely low operating costs. Optionally, using a second galvanometer can up to double its throughput capability. Another advantage is the possibility to process substrates with a size up to 18 × 18 in.
The system meets the current and future requirements of both the electronic and automotive industry in particular, and can be automated with many automation manufacturers using the company's system-standard SMEMA enclosure. Standalone or inline solutions are available.
For more information, please visit innolas-solutions.com.