Schott TEC TO package enables high-speed data transfer
A TEC TO package enables the development of high-speed data transfer in the data and telecommunications market, and is suited for 10 Gbit/s laser diodes that require a thermoelectric cooler (TEC). The design is based on an extended radio-frequency feedthrough, which has shortened wire-bonds to minimize signal losses to the laser diode.
Schott
Elmsford, NY
www.us.schott.com