Designs and manufactures antennas and power products for handsets, two-way radios, in-building wireless networks, telematics and wireless data devices.
The eTEC Series thermoelectric modules use thin-film technology that gives them 10X heat-pumping density per unit area over conventional bulk thermoelectric technology.
The OptoCooler HV37 module, a high-voltage, thin-film thermoelectric cooler, is designed for photonics cooling applications with large heat pumping requirements.
Nextreme Thermal Solutions, which makes thermoelectric devices to cool photonic and other components, announced that John Goehrke has joined the company as CEO.
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Nextreme Thermal Solutions has announced that its OptoCooler HV14 has passed the 3000G shock test as defined in the MIL-STD 883E Method 2002 Mechanical Shock standard, which establishes...
Nextreme Thermal Solutions (Durham, NC), provider of microscale thermal and power management products for the electronics industry, and Lockheed Martin (Bethesda, MD) entered ...
Nextreme Thermal Solutions (Durham, NC), known to many in the photonics industry as a maker of thermoelectric coolers, embedded thermoelectric coolers (which can, for example,...
Embedded thermoelectric coolers (eTECs) are smaller and thinner than conventional TECs and show promise for direct integration using standard high-volume manufacturing methods...
Nextreme Thermal Solutions (Durham, NC), which makes microscale thermal and power management products for the photonics and electronics industries, today announced securing $13...
Nextreme Thermal Solutions (Durham, NC), provider of microscale thermal and power management products, was awarded a grant from the North Carolina Green Business Fund to enhance...
Durham, NC--Nextreme Thermal Solutions has announced the availability of a new thermoelectric module—the Ultra-High Packing Fraction (UPF) OptoCooler module.
Thermoelectric coolers that take the form of a microns-thick film offer high heat-pumping capacity, millisecond response time, and the potential for low-profile packaging.
