DataRay to showcase line laser profiling system at SPIE BiOS and SPIE Photonics West 2017
The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width.
The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width. By scanning the company's WinCamD-LCM4 beam profiling camera across the length of the beam using its 50 or 200 mm linear stage, the software will display a full image of the line laser intensity distribution along with a vertical centroid plot, line width plot, and several other useful measurements.
SPIE BiOS/Photonics West booth number: 8410 (BiOS) and 1840 (Photonics West)
To Learn More:
Contact:DataRay
Headquarters: Redding, CA
Product: Line Laser Profiling System (LLPS)
Key Features: Displays a full image of the line laser intensity distribution
What DataRay says:
View more information on the Line Laser Profiling System (LLPS).
View More Products
Locate a vendor or system integrator in our Buyer's Guide.
Share new products that you think are particularly interesting or helpful by contacting Lee Dubay, Associate Editor, Laser Focus World.
