DataRay to showcase line laser profiling system at SPIE BiOS and SPIE Photonics West 2017

The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width.

Jan 19th, 2017
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The Line Laser Profiling System (LLPS) is a complete solution for analyzing line lasers up to 200 mm in length and down to 55 µm in width. By scanning the company's WinCamD-LCM4 beam profiling camera across the length of the beam using its 50 or 200 mm linear stage, the software will display a full image of the line laser intensity distribution along with a vertical centroid plot, line width plot, and several other useful measurements.

SPIE BiOS/Photonics West booth number: 8410 (BiOS) and 1840 (Photonics West)

To Learn More:

Contact:DataRay
Headquarters: Redding, CA
Product: Line Laser Profiling System (LLPS)
Key Features: Displays a full image of the line laser intensity distribution

What DataRay says:
View more information on the Line Laser Profiling System (LLPS).

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