Lithography mask-aligner tools now paired with simulation software
Garching, Germany--Semiconductor equipment and process solutions supplier SUSS MicroTec announced a cooperation agreement to combine the SUSS MicroTec lithographymask-aligner exposure-optics tools with the Layout LAB simulation software from GenISys GmbH (Munich, Germany), a provider of software solutions for nanoscale fabrication. The companies say that a combination of lithography equipment and matching simulation software is a key success factor for cost-effective process and device development for the end user.
"The sophisticated and latest SUSS exposure optics technology, MO Exposure Optics, enables the use of frontend technologies like illumination shaping and mask layout optimization on mask aligner equipment," said Frank P. Averdung, president and CEO of SUSS MicroTec AG. "This in combination with GenISys simulation software is a key technology enabler as it allows easy modeling of large numbers of different source shapes."
"Layout LAB [trade mark] is a professional full 3D simulation platform for optical proximity lithography, which enables to optimize mask layout and exposure conditions by running a large number of simulations overnight. Besides saving direct costs, users are gaining time to market," said Nezih Unal, VP of GenISys.
GenISys GmbH develops, markets, and supports software solutions for the optimization of microstructure fabrication processes. Addressing the market for e-beam direct-write and optical lithography micro-patterning technologies, GenISys says it combines technical expertise in layout data processing, process modeling, correction, and optimization with high-caliber software engineering and a focus on ease of use.
In close cooperation with research institutes and industry partners, SUSS MicroTec says it contributes to the advancement of next-generation technologies such as 3D integration and nanoimprint lithography as well as key processes for MEMS and LED manufacturing.
SOURCE: SUSS MicroTec; www.suss.com/company/news/press-center/detail/date/2012/02/21/article/1329813060.html