Underfill epoxy features nanosilica filler material
EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications. This optically clear compound features high dimensional stability with its nanosilica filler material and it has a glass transition temperature of >200°C.
Master Bond
Hackensack, NJ