Underfill epoxy features nanosilica filler material

    June 10, 2024
    EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications.
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    (Image credit: Master Bond)
    66478777ee6309eb95aa50a7 Master Bond

    EP114 two-component, low-viscosity, NASA low outgassing-rated, heat-cured epoxy has uses in underfill, coating, impregnating, and porosity sealing applications. This optically clear compound features high dimensional stability with its nanosilica filler material and it has a glass transition temperature of >200°C. 

    Master Bond

    Hackensack, NJ

    www.masterbond.com

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