Low-profile fast rotation stage is designed for semiconductor wafer positioning

June 29, 2021
The RGA150 low-profile fast rotation stage has been specifically designed for semiconductor wafer positioning applications.

The RGA150 low-profile fast rotation stage has been specifically designed for semiconductor wafer positioning applications. With an aperture diameter of 90 mm and a profile of 60 mm, it offers accuracy of ± 0.001° (mapped), bidirectional repetition of ±0.0975 mdeg, minimum incremental motion of 0.01 mdeg, and a maximum speed of 300 rpm.

Newport (MKS Instruments)

Irvine, CA

newport.com

GET PRICING

About the Author

LFW Staff

Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!