Finetech to showcase sub-micron die bonder at SPIE Photonics West 2016
The FINEPLACER Lambda 0.5 µm die bonder has uses in precision die attach and advanced packaging of photonic devices.
The FINEPLACER Lambda 0.5 µm die bonder has uses in precision die attach and advanced packaging of photonic devices. The semi-automated die bonder includes motorized rotation (theta) of die relative to the substrate and a dedicated control panel, which is helpful for large chips with dense pitch and small bumps that are usually being aligned with the two-point-alignment method. Applications include laser bar bonding with indium or gold/tin (including forming gas or formic acid), bonding of VCSELs/photodiodes, silicon photonics, and LED assembly, as well as an integrated dispense for photonic applications.
SPIE Photonics West booth number: 4644
To Learn More:
Headquarters: Gilbert, AZ
Product: FINEPLACER Lambda die bonder
Key Features: Motorized rotation
What Finetech says:
View more information on the FINEPLACER Lambda die bonder.
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