Home

Finetech to showcase sub-micron die bonder at SPIE Photonics West 2016

Jan. 24, 2016

The FINEPLACER Lambda 0.5 µm die bonder has uses in precision die attach and advanced packaging of photonic devices.

Content Dam Lfw Online Articles 2016 01 Finetech Lambda Die Bonder Web

The FINEPLACER Lambda 0.5 µm die bonder has uses in precision die attach and advanced packaging of photonic devices. The semi-automated die bonder includes motorized rotation (theta) of die relative to the substrate and a dedicated control panel, which is helpful for large chips with dense pitch and small bumps that are usually being aligned with the two-point-alignment method. Applications include laser bar bonding with indium or gold/tin (including forming gas or formic acid), bonding of VCSELs/photodiodes, silicon photonics, and LED assembly, as well as an integrated dispense for photonic applications.

SPIE Photonics West booth number: 4644

To Learn More:

Contact: Finetech
Headquarters: Gilbert, AZ
Product: FINEPLACER Lambda die bonder
Key Features: Motorized rotation

What Finetech says:
View more information on the FINEPLACER Lambda die bonder.

View More Products
Locate a vendor or system integrator in our Buyer's Guide.

Share new products that you think are particularly interesting or helpful by contacting Lee Dubay, Associate Editor, Laser Focus World.

About the Author

LFW Staff

Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.