• KLA-Tencor

    160 Rio Pobles MS D2129
    San Jose, CA 95134
    United States
    408-875-4460
    408-875-4144
    Visit Company Website
    5600

    More Info on KLA-Tencor

    Provides optical surface analyzers that automatically detect and classify surface defects on optoelectronic and semiconductor wafers, including transparent wafers such as sapphire and glass.

    Articles

    (Credit: Gerd Altmann/Pixabay)
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    Photonics advances in 2020 include commercial hollow-core fiber, deep learning for numerous purposes, and advanced ultrafast lasers for materials processing.
    FIGURE 1. The compact 3D interferometric optical profiler is shown (a) [4]; the x-y stage positions the sample and tilts in two directions to align the sample to the objective lens axis for interferometric measurement. The simplified optical layout (b) is also shown; the focal point of the objective lens is scanned vertically through the measurement distance. A low-coherence-length white-light LED is used for interferometric measurement of topography by WLI, PSI, and True Color measurement of the sample surface at each topographic height determined by interferometry.
    Combining white-light interferometry (WLI), phase-shift interferometry (PSI), True Color imaging, and stitching into one optical profiler characterizes flexible electronics devices...
    12 Lfw 12 Klatencor
    The Archer 500 overlay metrology system for logic and memory chip manufacturers enables lithographers to verify that pattern features have been correctly aligned.
    Milpitas, CA--A new generation in KLA-Tencor's family of wafer inspection systems—the Surfscan SP3 with DUV illumination—was introduced for 28 nm and below semiconductor nodes...
    Content Dam Etc Medialib Platform 7 Laser Focus World Articles Online Exclusive Articles 2010 Global 69214
    The ICOS WI-2250 wafer inspection system provides automated optical inspection for LED and MEMS products.
    San Jose, CA--At the SPIE Microlithography meeting yesterday, Cymer (San Diego, CA) announced a collaboration with KLA-Tencor (San Jose, CA), in which Cymer will provide details...
    San Jose, CA--In the last two decades, integrated-circuit (IC)-chip feature sizes have shrunk from a micron in width to one tenth that, and are still shrinking. Over that span...
    FIGURE 1. A nine-element objective is corrected from 266 to 800 nm (top); it has an NA of 0.9, a field size of 0.13 mm, and is optimized to minimize the manufacturing tolerances and has reduced central obscuration. The objective has a standard object-to-flange distance of 45 mm. A seven-element objective is corrected from 266 to 800 nm (bottom); it has an NA of 0.9 and a field size of 0.13 mm.
    Many microscopy applications can benefit from broadband deep-UV (DUV) imaging, some of which also require immersion, cover glass correction, or operation over a wide temperature...
    KLA-Tencor (San Jose, CA) has acquired Nanopro (Frieburg, Germany), a privately held company specializing in advanced interferometric technology for measuring semiconductor-wafer...
    Polystyrene spheres, 0.496 mm in diameter, were deposited on the left half of a polished wafer and then scanned using circular polarization (left). The histogram at the bottom shows the detected size distribution of the spheres. The peak in the green area indicates that identical spheres are being detected as uniformly sized. The same wafer was scanned using linear polarization (right). Because linear polarization is unable to eliminate the effect of nonuniform film thickness, identical spheres in different locations have been detected as widely distributed in size. As a result, the green area of the histogram at the bottom has no peak.
    When mapping the surface of wafers, standard-diameter latex spheres can relate the scattering cross sections of different systems.

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