“Co-packaged optics represents a major technology transition for AI hardware, but it also introduces significant integration challenges, requiring the integration of photonic and electronic components through advanced packaging technologies that demand comprehensive process expertise rather than just point solutions,” stated Dr. Bernd Dielacher, director of business development at EVG. “By combining decades of experience across these disciplines with close collaboration through our Competence Centers, EVG helps customers develop, optimize and validate complete manufacturing processes from early development through HVM, enabling the successful deployment of next-generation CPO architectures.”

Comprehensive Process Expertise for CPO Manufacturing

EVG’s process portfolio addresses numerous critical manufacturing requirements across the CPO ecosystem. Hybrid bonding enables low-parasitic integration of PICs and electronic integrated circuits (EICs) to support future bandwidth requirements, while fusion bonding enables heterogeneous integration of III-V semiconductor materials for laser fabrication as well as emerging modulation materials such as thin-film lithium niobate (TFLN) and barium titanate (BTO). Oxide-free room-temperature bonding ensures low-loss, optically transparent interfaces and integration of heat spreader materials such as diamond and silicon carbide (SiC) for effective heat transfer through interfaces.

Nanoimprint lithography provides a scalable manufacturing approach for grating couplers, vertical optical coupling elements and beam-shaping elements that facilitate efficient out-of-plane light coupling for chip-to-chip and chip-to-fiber optical interconnects, as well as wafer-level optics used in microLED lens packaging. Additional capabilities, including temporary bonding and debonding, support wafer thinning for laser diode fabrication and advanced packaging applications.

Looking beyond CPO, the industry is expected to transition towards optical I/O chiplet architectures and advanced 3D photonic-electronic integration, enabling even tighter co-integration of silicon photonics, CMOS electronics, and laser sources within highly scalable optical interconnect platforms. Building on its proven track record in semiconductor 3D/heterogenous integration, EVG is well positioned to support both today’s CPO implementations and future optical I/O architectures, extending established electronic integration concepts to the next generation of photonic-electronic systems.

Meet EVG at SEMICON Taiwan 2026

To speak with an EVG representative and learn more about the company’s industry-leading solutions for co-packaged optics and other critical technologies, visit EVG’s booth #L0310 during exhibition hours.

About EV Group (EVG)

EV Group (EVG) provides innovative process solutions and expertise that serve leading-edge and future semiconductor designs and chip integration schemes. The company’s vision of being the first in exploring new techniques and supporting next-generation applications of micro- and nanofabrication technologies enables customers to successfully commercialize new product ideas. EVG’s high-volume-manufacturing-ready products, which include wafer bonding, lithography, thin-wafer processing and metrology equipment, enable advances in semiconductor front-end scaling, 3D integration and advanced packaging, as well as in other electronics and photonics applications. More information about EVG is available at www.EVGroup.com.