On Semiconductor

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602-244-3182
602-244-3345

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Supplies high performance silicon solutions for energy efficient electronics.

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(Image credit: Nanjing University)
FIGURE 1. Device architecture and metalens fabrication: a schematic of the optical setup for MIID (a), a photograph of the highly compact MIID (b), and a top-view optical microscope image and side-view SEM image of the fabricated α-Si metalens with a diameter of 200 μm (c).
Researchers at Nanjing University have developed a metalens-integrated imaging device (MIID) and centimeter-scale microscopic imaging prototype that breaks FOV constraints.
ON Semiconductor was selected by Audi to be part of its Progressive SemiConductor Program (PSCP).
ON Semiconductor is collaborating with Baidu on the Baidu Apollo Autonomous Driving Platform.
1706 Lfw Pro 11
The KAE-04471 4 Mpixel interline transfer EMCCD image sensor uses 7.4 μm pixels to improve image quality under light-starved conditions.

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