Reliability Testing and Burn-in Optimization for Semiconductor Lasers and Optoelectronics

In this webinar, you’ll learn about the methodology for reliability qualification and optimizing burn-in. You’ll also learn about the range of reliability and burn-in hardware on the market, and newly-available reliability-test-as-a-service options.

July 16, 2024
11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 4:00 PM GMT 
 
Duration: 1 hour
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This webinar will include live captioning in English, Chinese, and Japanese.

Summary

Laser reliability has been a key to new product qualification for data communications products, and many other upcoming applications, including powering AI clusters, cloud data centers, and LIDAR for autonomous driving. After starting with a case study, we’ll talk about the process of reliability qualification, where the reliability risk usually lies, and potential test platforms. Typical reasons for device failure will also be covered. Then we’ll cover the different reliability test hardware on the market for both engineering qualification and high-volume burn-in. Different supported form-factors will be detailed. We’ll close with the introduction of new “reliability-test-as-a-service” and outsourced burn-in options, and the chance to ask questions about laser reliability and reliability testing methods. 

Speakers

Dr. Robert W. Herrick 
Consultant 
Robert Herrick Consulting 


Dr. Herrick started his career in the late 1980’s as a designer and process development engineer on some of the earliest photonic integrated circuits in research funded by the US Air Force. After being frustrated with the short lifetimes of the early devices, and being inspired by the late Dr. Robert Waters, he went back to the UCSB to get a PhD, studying the causes of VCSEL degradation with Professors Pierre Petroff and Larry Coldren. Since 1997, he has been a reliability engineer in Silicon Valley, focusing on the reliability and failure analysis of semiconductor lasers, and optoelectronic devices.

He has worked for most of the large American transceiver companies, including Hewlett Packard / Agilent, Emcore, Finisar, and JDSU. From 2013 to 2023, he established the reliability test and failure analysis capabilities at Intel for their Silicon Photonic Product Division, taking it from an Intel Labs operation to a 2-million-transceiver-per-year run rate, as the Principal Engineer responsible for laser and optoelectronics reliability. 

He left Intel in March of 2023, and now runs his own reliability consulting firm, which is primarily focused on assisting silicon photonic start-ups with the reliability qualification of new products. He has published many of the most cited articles in the field, 8 invited book chapters, and 1 edited book on the topic of semiconductor laser reliability. He lives in San Jose, California. 

John R. Tessitore 
Vice President of Sales and Marketing 

Chroma ATE Inc.

John R. Tessitore is the Vice President of Sales and Marketing at Chroma ATE Inc.  John has enjoyed a successful career in test engineering where he developed test solutions for ASICs, Electro-mechanical Systems, Military GPS Validation, Aircraft Flight Control Systems, Power Systems and more. In the late 1990’s John spearheaded a broadband team who developed commercially deployed Laser Diode Reliability Systems to support the demand in hardware created by the dot-com boom. 

John’s passion in photonic testing led him to pursue a role in sales, where he could help multiple clients at the same time with their diverse challenges by providing the tools needed to qualify and verify the performance and reliability of active optical components. In sales, he has assisted in the production of some of the most commonplace technologies (sensing and communications from gaming and mobile devices to AI and data centers) that are in use worldwide today. John earned a BSEE degree from California State Polytechnic University Pomona. 

Leo Lu 
Sales Manager 
Testar 


Leo Lu started his career journey in 2003, diving into an innovative project focused on nano-scale material and vacuum device applications. After five years of dedicated work in this field, he transitioned to diode epitaxy development, serving both consumer and special lighting markets for six years. 
In 2014, he shifted gears once more, immersing himself in assembly packaging for a two-year period. 

It was during this time that he initiated efforts to enhance packaging performance for customers. This included outsourcing automated visual inspection services to Testar. Recognized for his expertise and contributions, Leo was subsequently invited to join Testar, where he’s now in charge of international business associated with back-end services and setup of assembly process line reliability testing for photo diodes and VCSELs.

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