A Low-Cost, Near-Hermetic Air-Cavity Package for Photonics Integrated Circuits (PICs)

Discover how a revolutionary low-cost package solution, leveraging air cavity plastic technology from RF power applications, is poised to transform photonics with enhanced flexibility, shorter delivery times, and near-hermetic performance in this groundbreaking webinar.

December 5, 2024

11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 4:00 PM GMT

Duration: 1 hour

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This webinar presents a low-cost package solution that can replace butterfly packages used in photonics. The solution is based on existing air cavity plastic package technology used in RF power applications and offers additional flexibility in geometry and leadframe/heatsink materials combined with shorter prototype delivery times, and near-hermetic package performance. 


Sander Dorrestein 
Program Manager of the Integrated Photonics 
Chip Integration Technology Center 

Alexander (Sander) C.A.J. Dorrestein is the program manager of the Integrated Photonics at Chip Integration Technology Center (CITC). He is a mechanical engineer with a special interest in micro-assembly processes and technologies. He has broad experience in the field of packaging technologies for both micro-electrical and micro-optical packaging. He has a proven track record of developing bonding and joining processes that are currently used in production for consumer, medical, industrial, and automotive applications. 

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