Nd:YAG lasercutting system

The LCS III TriLite Nd:YAG lasercutting system delivers three wavelengths (1064, 532, and 355 nm) for design verification, failure analysis, liquidcrystal display repair, and other semiconductor applications. The infrared wavelength removes metal lines without damaging silicon substrates. The green wavelength cuts metals and removes oxides. The ultraviolet wavelength removes polyimide without affecting materials underneath. The system produces uniform repeatable cuts across a 50 ¥ 50µm a

The LCS III TriLite Nd:YAG lasercutting system delivers three wavelengths (1064, 532, and 355 nm) for design verification, failure analysis, liquidcrystal display repair, and other semiconductor applications. The infrared wavelength removes metal lines without damaging silicon substrates. The green wavelength cuts metals and removes oxides. The ultraviolet wavelength removes polyimide without affecting materials underneath. The system produces uniform repeatable cuts across a 50 ¥ 50µm area using a 50X objective.

Atomic force microscope

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