• Researchers report promising method to fabricate ultra-thin silicon solar cells

    July 14, 2008--New lift-off process produces silicon wafers 30 to 50 microns thin, say IMEC researchers. Reducing the amount of silicon is a promising way to reduce the cost of solar-cell wafers.
    July 14, 2008

    July 14, 2008--The nanotechnology research center IMEC (Leuven, Belgium) announced at the Semicon West 2008 conference in San Francisco that it is developing a new method to produce 50 µm thin crystalline silicon (Si) wafers for use in solar cells. The process involves mechanically initiating and propagating a crack parallel to the surface of a Si wafer. The method makes use of industrially available tools and is potentially kerf-loss free.

    Sign up for Laser Focus World Newsletters
    Get the latest news and updates.

    Voice Your Opinion!

    To join the conversation, and become an exclusive member of Laser Focus World, create an account today!