Fall MMRC Meeting to focus on optoelectronics packaging

July 20, 2001
The October meeting will focus on topics such as enabling technology and government policy considerations.

Washington, DC – The Microelectronics Marketing Research Council (MMRC) Fall meeting will focus on optoelectronics packaging, covering such topics as relevant issues, enabling technology, and government policy considerations. Sponsored by the International Microelectronics and Packaging Society (IMAPS), the meeting will convene October 5 to 7, 2001, at the Westin Fairfax Hotel, Washington, DC. Program Chair is E. Jan Vardaman of TechSearch International, Inc.

Presentations will focus on the market for packaging technology, including drivers for the growth of the optoelectronics industry. Key roadmaps from around the globe will be presented. Issues to be addressed will include requirements for low-cost packaging solutions, material and substrate needs, and assembly-equipment automation requirements enabling the mass-production of low-cost packages. Presenters will also examine key US Government funding activities and policies to promote the development of the optoelectronics industry.

In 1987, representatives from the International Microelectronics and Packaging Society (IMAPS) and the IPC met to form the Microelectronics Marketing Research Council (MMRC). The MMRC targets the industry�s marketing professionals through the IMAPS Organizational Member Community. It provides a forum for members to organize and support programs designed to analyze the technology and competitive elements impacting the microelectronics packaging marketplace. From technical trends to market forecasts, the MMRC assists its members in assessing the strategic focus and direction of the microelectronics packaging industry. To find out more, visit www.imaps.org or contact IMAPS at 611 2nd Street, NE, Washington, DC 20002, Tel. 202-548-4001; Fax 202-548-6115.

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