Xloom releases 30-Gbps optical interconnect

Nov. 8, 2005
November 8, 2005, Sunnyvale, CA--XLoom Communications, a developer of chip-scale optoelectronic interconnects, announced the availability of InfiniFlame 12X. According to Xloom, InfiniFlame is the first front-panel pluggable optical module for interconnecting High-Performance Computing (HPC) clusters for InfiniBand networks.

November 8, 2005, Sunnyvale, CA--XLoom Communications, a developer of chip-scale optoelectronic interconnects, announced the availability of InfiniFlame 12X. According to Xloom, InfiniFlame is the first front-panel pluggable optical module for interconnecting High-Performance Computing (HPC) clusters for InfiniBand networks.

Each InfiniFlame 12X optical transmitter/receiver pair is a 12-channel InfiniBand-ready optical interconnect that supports speeds of up to 30Gbps per port. InfiniFlame features a low power dissipation of 2.5W per transmitter/receiver pair and a standard MTP/MPO optical interface. InfiniFlame 12X optical modules provide enterprises with longer reaches between clusters of up to 200 meters using standard multimode fibers, an alternative to bulky copper cables that are limited to a reach of 5-10 meters.

"We will be announcing InfiniFlame design wins with major switch vendors during first quarter 2006," said David Sachs, Xloom's vice president for US sales and product marketing. "XLoom's BlueFlame technology for wafer-level fabrication of optoelectronic devices drives power, size and cost down, making InfiniFlame a cost-effective interconnect solution for users of high-performance computing applications."

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