Glass soldering improves photonic component packaging

Nov. 1, 1994
Fiberoptic components are frequently subjected to harsh outdoor environments with little or no protection against temperature and humidity extremes. Because longterm reliability and performance of a component are generally determined by its packaging, the techniques and materials used in the assembly of the components are critical.

Hani S. Daniel, Douglas R. Moore, and Vincent J. Tekippe

Johnson Matthey leads ARPAsponsored optoelectronics consortium

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