Master Bond EP21TCHT-1 is a two component, thixotropic paste formulated for bonding and sealing applications. This system has been used in various applications involving different substrates and service conditions and requirements. Multiple published research articles from University of Florida, Princeton University and NASA, among others make reference to the use of Master Bond EP21TCHT-1. This heat resistant epoxy is serviceable over the temperature range of 4K to +400°F and maintains its properties under cryogenic conditions. It is a room temperature curing compound that is thermally conductive and electrically insulative. EP21TCHT-1 passes NASA low outgassing testing and is therefore recommended for use in vacuum environments and opto-electronic applications. Click here to review a summary of the many ways EP21TCHT-1 has been effectively used in research labs and commercial applications.
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