MindCurrents metrology device incorporates area-scan CCD
EdgeXplorer, a wafer edge metrology device, can detect chips, pits, cracks, scratches, and other edge defects as small as 10 μm. Its size (254 × 254 × 378 mm for 200 mm wafers, and 356 × 356 × 378 mm for 300 mm wafers) enables the conversion of new/existing wafer handling tools to metrology tools without increasing tool footprint. The inspection system uses an area-scan CCD camera and high-brightness, software-controlled pulsed LED for illumination.
MindCurrents
Austin, TX
[email protected]
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PRESS RELEASE
COMPACT, LOW COST, FAST...
Use Your Wafer Handler to Inspect!
EdgeXplorerTM, a wafer edge metrology device, is designed to improve the performance and increase value of new/existing wafer handling tools. EdgeXplorerTM can detect chips, pits, cracks, scratches, particles, film peeling, contamination, stains, and other edge defects as small as 10 µm. Its compact
size enables the conversion of new/existing wafer handling tools to metrology
tools without increasing tool footprint.
» Lowest Cost
» Smallest footprint — No footprint increase if an existing tool is used
» High throughput
» Built-in pre-alignment capability
» Simplified wiring — Only AC power and gigabit ethernet connection
» No separate external controller required
» Self-learning inspection algorithm — No recipe required
» User configurable defect sensitivity controls
» Remote database storage interface
» Optional automated defect classification
» Optional remote off-line defect review software
» Optional statistical process control software
Application
» Wafer manufacturing —
Outgoing wafer quality control (QC) » Incoming wafer QC for device manufacturers » Device yield enhancement (pre and post process QC)
> In-situ monitoring of wafer edge defects and contamination prior to immersion or imprint lithography step
> Crack detection due to thermal and mechanical stress, following RTP and CMP steps, respectively
> Crack detection post MEMS backgrinding process
> Detect particles and film delamination which can flake off onto the top side of wafer (e.g. Cu plating, Cu CMP) » Process tool dial-in and monitoring
> In-situ metrology of EBR (Edge Bead Removal)
> In-situ monitoring of edge bevel clean distance in plasma or CMP bevel clean tools
Key advantages of EdgeXplorerTM over traditional inspection tools are:
1 Wafer Throughput
It is one of the fastest wafer edge inspection devices on the market. Its impressive performance and high throughput translate to higher ROI (Return On Investment).
2. Pre-alignment Capability and Value Enhancement of Existing Tools
It features a built-in wafer pre-alignment capability. Since most wafer sorters and EFEM’s (Equipment Front End Module) have pre-aligners, customers can utilize the same space taken up by the pre-aligner to install the EdgeXplorerTM. A wafer handling tool can be converted to an inspection tool easily. No footprint increase is needed.
3. Illumination (Patent Pending)
It uses an advanced and proprietary illumination technology which enables high scan speed and effectively isolates the system from environmental vibration without the use of traditional isolation systems such as heavy granite/various types of active/passive isolation devices.
4. Advanced Inspection Optics
It features a GigE CCD camera and precision optics components. The enclosure is optimized via computational fluid modeling in order to keep the camera cool. Consequently, the camera noise remains low.
Specification
Size
Weight (mass)
Wafer Throughput (WPH)*
Inspection System
Illumination
Substrate Size
Wafer Contact
Detection resolution**
Detection Repeatability
Communication Protocol
Built-in prealigner Repeatability
pre-aligner alignment time
Excludes wafer pre-alignment. Apex & top/bottom bevel inspection only.
Better resolution possible with higher optical magnification and/or higher resolution camera
10” W x 10” D x 14.9” H (254mm x 254mm x 378mm) for 200mm or smaller wafer sizes
14” W x 14” D x 14.9” H (356mm x 356mm x 378mm) for 300mm
22.8 lbs (10.3 kg)
Greater than 500 for 200mm, 333 for 300mm
High speed area scan CCD camera (Color or Monochrome)
High brightness pulsed LED (Software controlled), patent pending
100mm to 450mm
3 point edge contact for pre-alignment. Backside contact area: < 0.3 % for 300mm wafer
10um
Better than 99%
TCP/IP or RS–232 Serial
± .01°
< 4 Seconds
RS232 Control
Interface
EdgeXplorer Image
Processing PC
Customer SuppliedRemote Data Storage
Customer Remote Access to
EdgeXplore Database
EdgeXplorer
Black Box
Pre-Aligner
Customer
TCPIP Network
5. Motion Control & Simplified Wiring
It features a distributed motion control technology, utilizing an FPGA (Field Programmable Gate Array). The entire motion control hardware resides inside the device, eliminating all control wiring, minimizing external cabling — common system architecture seen in traditional systems. The system only requires an external computer on a gigabit network, running MindCurrents’ proprietary software. No separate external controller is necessary.
6. Modularity and Design for Maintenance
The overall system is completely modular and can be easily reconfigured for various custom applications. (e.g. larger substrate, scanning different areas of the wafer, etc.). Additionally, the hardware unit is designed for ease of maintenance via our plug-and-play like design. The unit is small enough for customers to stock additional units in case of down time. Units can be shipped back to MindCurrents easily for repair/maintenance/upgrades. No wooden crate is required for safe shipping.
7. Software Featuresa. User configurable defect sensitivity controls.
b. Self learning inspection algorithms eliminate the need for manual recipe generation for each wafer type and allow the operator to tune-in or tune–out specific defect type.
c. Remote database storage of defect images and classification data for customers willing to provide a remote hard drive for this purpose. All historical images and defect data can be stored remotely.
d. Remote off-line edge defect review software including a historical accounting of wafer defect status based on Wafer ID, Wafer Lot, Time and Date, etc. This application can be run on any remote windows PC with a network connection to the remote database.
e. Ethernet (TCP/IP) or serial (RS-232) with a configurable result feedback upon completed inspection.
f. Optional statistical process control (SPC) software.
g. KLARF file compatibility.
8. Service and UpgradesAll hardware components can be fully controlled and updated via a secure remote ethernet (TCP/IP) connection. Consequently, if internet access is provided, MindCurrents’ service engineers can provide fast and prompt service from MindCurrents’ headquarters.
www.MindCurrents.com
Contact
MindCurrents, LLC.
5555 N. Lamar Blvd. Suite J-107, Austin, TX 78751
Phone: 512.206.0071
Email: [email protected]