Wafer scanner from Raylase works with laser powers up to 2 kW
Nov. 12, 2018
The Superscan IV-15 Wafer two-axis deflection unit is designed for wafer manufacturing, including structuring solar cell wafers, when high angular velocity is required. The device's model-based digital control offers speeds up to 200 rad/s. It works with laser powers up to 2 kW when quartz mirrors are used. Lenses with optimized holders and scan mirrors are available for all standard lasers.
Raylase
Wessling, Germany
Sponsored Recommendations
Sponsored Recommendations
How nanopositioning helped achieve fusion ignition
Jan. 31, 2025
Voice your opinion!
Voice your opinion!