SUSS MicroTec Teams With IMEC for MEMS Packaging

Feb. 23, 2004
Saint-Jeoire, France, February 24, 2004. SUSS MicroTec has signed a Joint Development Program with IMEC, a nanotechnology research center. MEMS devices are set to have an enormous impact across the industrial spectrum - from biotechnology, through medical devices, process control to advanced mechanical systems.

Saint-Jeoire, France, February 24, 2004. SUSS MicroTec has signed a Joint Development Program with IMEC, a nanotechnology research center. MEMS devices are set to have an enormous impact across the industrial spectrum - from biotechnology, through medical devices, process control to advanced mechanical systems.

Microelectromechanical systems (MEMS) promise exciting solutions for a myriad of applications by allowing the micro-scale integration of mechanical elements with supporting integrated circuits. The assembly and packaging of these tiny devices, however, has presented challenges for handling, maneuvering, and bonding sub-components with extreme exactness. But their commercialization is currently hampered by the lack of miniaturized and cost-effective 0-level bonding processes.

IMEC and SUSS MicroTec will collaborate closely to develop innovative bonding technologies that will not influence the performance of these sensitive devices. Specifically, SUSS MicroTec has supplied IMEC with a FC150 Automated Device Bonder to perform all bonding tests realized in the frame of this one-year research program.

More specifically, in this program IMEC and SUSS MicroTec will (i) develop new processes to solve the problem of oxidation of Indium used for high performance flip-chip bonds, (ii) develop innovative fluxless solder and polymer sealing processes for 0-level packaging of MEMS devices, and (iii) develop process for the handling and positioning of extreme thin chips and MEMS sealing caps. Additionally, IMEC will use the FC150 system for all its other advanced flip-chip bonding activities in the field of MEMS and high-density packaging.

Equipped with two bonding heads, the FC150 that will be installed at IMEC's facility in Leuven, Belgium, supports a broad range of various bonding processes: thermo-compression, solder reflow, UV curing, etc. This specific configuration results in the capability of applying very low forces down to 15 g while also supporting forces of up to 200 kg. The FC150 ensures a unique ability to handle fragile and small components with the additional benefit of accommodating unusual shapes such as fiber optics, ball lenses, preforms, thanks to a customized vacuum tooling design.

Furthermore, the SUSS FC150 produces the sub-micron alignment if required. Alignment is done before bringing parts into contact. When using the automatic alignment option, the system can align devices to a substrate using features instead of alignment marks. If components are very small or reflect the light poorly, SUSS offers an advanced laser leveling system that enables perfect leveling of even odd shaped pieces. The imaging system presents a total magnification of 400X and ensures a very high pre-alignment and post-bonding accuracy of one micron.

SUSS MicroTec is a supplier of production, process and test technology for the semiconductor industry with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography systems, substrate bonders, flip-chip bonders and probe systems.

Headquartered in Munich, Germany, SUSS has approximately 720 employees worldwide and provides support from sales and service centers in North America, Europe, Asia and Japan.

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