CEA-Leti signs new industrial partnership

May 3, 2004
Grenoble, France, May 3, 2004--The CEA Electronic and Information Technologies Laboratory (CEA-Leti) and Intexys have concluded a research and development partnership that gives industry access to prototyping and assembling facilities utilizing the Platimo platform.

Grenoble, France, May 3, 2004--The CEA Electronic and Information Technologies Laboratory (CEA-Leti) and Intexys have concluded a research and development partnership that gives industry access to prototyping and assembling facilities utilizing the Platimo platform. In addition to Intexys, other companies that have contracted to use Platimo are NanoLase and Teem Photonics.

Set up in the Optronics Department of CEA-Leti and co-financed by the Rhône-Alpes region, Platimo is dedicated to micro-component integration such as microchip lasers and planar fiber beam splitters. The platform is an automated system designed to speed up the prototyping process and enable automated assembly solutions. Platimo's main component is a versatile assembly robot called Optobonder that enables passive and active component alignment with fixing solutions such as gluing or soldering.

"Considering that photonic system assembly represents about 40% of the global cost of a product, the Platimo platform represents a strategic advantage for industrialists whose aim is to reduce the sales price of their product," said Christophe Kopp, manager of Platimo.

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