The Blaze LP nanosecond laser features SpotLock pumping technology to minimize thermal effects in the laser crystal, which improves beam control quality and enables spot size and corresponding focal position to remain constant. The laser drills more than 10,000 holes/sec at a wafer thickness of 120 µm.
Nanosecond laser with exceptionally high beam-pointing stability
February 5, 2010
With the Blaze™ - series LUMERA LASER presents high-performance, nanosecond lasers. Thanks to patented SpotLock™ pumping technology, these lasers have an excellent beam characteristic even at high average power and repetition rates. SpotLockTM guarantees extremely high beam-pointing stability for precise machining of various materials.
The new patented pumping technology minimizes thermal effects in the laser crystal, which usually negatively affects the laser performance and stability of high-power laser systems. As a result, in comparison to conventional technologies, the lasers achieve a significantly higher performance and improved beam control quality. SpotLock™ enables the spot size and the corresponding focal position to remain constant over the entire repetition range. When changing the process parameters no adjustments outside of the beam source needs to be made, thus avoiding costly set-up times.
For the processing of materials which exhibit poor absorption in the infrared spectrum, LUMERA LASER provides a frequency-doubled version of the Blaze™.
The high energy version Blaze™-HE produces - particularly at low repetition rates - pulses with ultra-high energy at a constant high beam quality in the TM00 mode.
With the Blaze™ LP-long pulse laser LUMERA LASER offers a high-power laser, which specifically meets the requirements of the solar industry. More specifically, in EWT (Emitter Wrap-Through) - solar cell technology, the contacts are moved to the back of the modules, such that the contacts do not shade the solar cell which increasing the efficiency by one third. For this application conventional laser systems produce only from 3000 to 5000 holes per second. Due to the longer pulses the Blaze™ LP drills more than 10,000 holes per second with maximum precision at a wafer thickness of 120 microns. This allows the required high throughput at a consistently excellent quality, resulting in a significant cost advantage in this application field.
All lasers of the Blaze™ - series can be run in 3 modes of operation in order to optimise the process parameters within each application:
In the E-Max Mode, the Blaze™ is operated at maximum pulse energy. In doing so the energy increases towards the low pulse repetition rates.
The E-Lock Mode generates pulses with constant energy regardless of the repetition rate and even starting with the first pulse. This enables the drilling of holes at defined intervals during the acceleration and deceleration phase of a scanner.
In the E-Free Mode, the operator can freely choose the pulse energy of each individual pulse.
Through these degrees of freedom, the laser can be optimized quickly for any specific application.
The different model options of the Blaze™ series offer customized solutions for all high precision material machining.
Posted by Lee Mather
Subscribe now to Laser Focus World magazine; it's free!