Palomar Technologies to showcase die bonder at SPIE Photonics West 2019
The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market.
The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market. Package assemblies are smoothly and efficiently transferred from presentation station to bonding station with a high-speed die shuttle. It also features the company's VisionPilot with Radar Referencing pattern recognition software to maximize throughput.
SPIE Photonics West booth number: 4522
To Learn More:
Contact: Palomar Technologies
Headquarters: Carlsbad, CA
Product: 6532HP die bonder
Key Feature: VisionPilot with Radar Referencing pattern recognition software to maximize throughput
What Palomar Technologies says:
View more information on the 6532HP die bonder.
Locate a vendor or system integrator in our Buyer's Guide.
Share new products that you think are particularly interesting or helpful by contacting Lee Dubay, Associate Editor, Laser Focus World.
