Palomar Technologies to showcase die bonder at SPIE Photonics West 2019

Jan. 25, 2019

The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market.

LFW Staff

Content Dam Lfw Online Articles 2019 01 6532hp Machine Three Quarter View 8022b Rev1 Cropped

The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market. Package assemblies are smoothly and efficiently transferred from presentation station to bonding station with a high-speed die shuttle. It also features the company's VisionPilot with Radar Referencing pattern recognition software to maximize throughput.

SPIE Photonics West booth number: 4522

To Learn More:

Contact: Palomar Technologies

Headquarters: Carlsbad, CA

Product: 6532HP die bonder

Key Feature: VisionPilot with Radar Referencing pattern recognition software to maximize throughput

What Palomar Technologies says:

View more information on the 6532HP die bonder.

View More Products

Locate a vendor or system integrator in our Buyer's Guide.

Share new products that you think are particularly interesting or helpful by contacting Lee Dubay, Associate Editor, Laser Focus World.

About the Author

LFW Staff

Published since 1965, Laser Focus World—a brand and monthly magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.