Palomar Technologies to showcase die bonder at SPIE Photonics West 2019

The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market.

Content Dam Lfw Online Articles 2019 01 6532hp Machine Three Quarter View 8022b Rev1 Cropped

The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market. Package assemblies are smoothly and efficiently transferred from presentation station to bonding station with a high-speed die shuttle. It also features the company's VisionPilot with Radar Referencing pattern recognition software to maximize throughput.

SPIE Photonics West booth number: 4522

To Learn More:

Contact: Palomar Technologies

Headquarters: Carlsbad, CA

Product: 6532HP die bonder

Key Feature: VisionPilot with Radar Referencing pattern recognition software to maximize throughput

What Palomar Technologies says:

View more information on the 6532HP die bonder.

View More Products

Locate a vendor or system integrator in our Buyer's Guide.

Share new products that you think are particularly interesting or helpful by contacting Lee Dubay, Associate Editor, Laser Focus World.

More in Positioning, Support & Accessories