• Palomar Technologies to showcase die bonder at SPIE Photonics West 2019

    The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market. 
    Jan. 25, 2019

    The Palomar 6532HP 1.5 µm die bonder is designed for the precise and high-volume device assembly requirements of the photonics market. Package assemblies are smoothly and efficiently transferred from presentation station to bonding station with a high-speed die shuttle. It also features the company's VisionPilot with Radar Referencing pattern recognition software to maximize throughput.

    SPIE Photonics West booth number: 4522

    To Learn More:

    Contact: Palomar Technologies

    Headquarters: Carlsbad, CA

    Product: 6532HP die bonder

    Key Feature: VisionPilot with Radar Referencing pattern recognition software to maximize throughput

    What Palomar Technologies says:

    View more information on the 6532HP die bonder.

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