Finetech to showcase die bonder at SPIE Photonics West 2019
The FINEPLACER Femto 2 die bonderoffers placement accuracy of 0.5 µm at 3 sigma. The modular bonder can be individually configured and retrofitted to support new applications and technologies, and handles the entire workflow of inspection, characterization, packaging, final test, and qualification. It supports assembly of optoelectronic components such as laser diodes, laser bars, VCSELs, photodiodes, and micro-optics, among others.
SPIE Photonics West booth number: 5269
To Learn More:
Contact: Finetech
Headquarters: Gilbert, AZ
Product: FINEPLACER Femto 2 die bonder
Key Feature: Placement accuracy of 0.5 µm at 3 sigma
What Finetech says:
View more information on the FINEPLACER Femto 2 die bonder.
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