Finetech to showcase die bonder at SPIE Photonics West 2019

Jan. 31, 2019
The FINEPLACER Femto 2 die bonder offers placement accuracy of 0.5 µm at 3 sigma. 

The FINEPLACER Femto 2 die bonderoffers placement accuracy of 0.5 µm at 3 sigma. The modular bonder can be individually configured and retrofitted to support new applications and technologies, and handles the entire workflow of inspection, characterization, packaging, final test, and qualification. It supports assembly of optoelectronic components such as laser diodes, laser bars, VCSELs, photodiodes, and micro-optics, among others.

SPIE Photonics West booth number: 5269

To Learn More:

Contact: Finetech

Headquarters: Gilbert, AZ

Product: FINEPLACER Femto 2 die bonder

Key Feature: Placement accuracy of 0.5 µm at 3 sigma

What Finetech says:

View more information on the FINEPLACER Femto 2 die bonder.

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LFW Staff

Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.

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