Finetech to showcase die bonder at SPIE Photonics West 2019

The FINEPLACER Femto 2 die bonder offers placement accuracy of 0.5 µm at 3 sigma.

Content Dam Lfw Online Articles 2019 01 Fineplacer Femto2 Web

The FINEPLACER Femto 2 die bonderoffers placement accuracy of 0.5 µm at 3 sigma. The modular bonder can be individually configured and retrofitted to support new applications and technologies, and handles the entire workflow of inspection, characterization, packaging, final test, and qualification. It supports assembly of optoelectronic components such as laser diodes, laser bars, VCSELs, photodiodes, and micro-optics, among others.

SPIE Photonics West booth number: 5269

To Learn More:

Contact: Finetech

Headquarters: Gilbert, AZ

Product: FINEPLACER Femto 2 die bonder

Key Feature: Placement accuracy of 0.5 µm at 3 sigma

What Finetech says:

View more information on the FINEPLACER Femto 2 die bonder.

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