Copper oxide-coated foam heat sink from Goodfellow offers ~37% relative density

Microporous copper foam coated with a thin, hard layer of copper oxide serves as a low-profile heat sink in passive cooling environments.

Feb 19th, 2016
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Microporous copper foam coated with a thin, hard layer of copper oxide serves as a low-profile heat sink in passive cooling environments. The underlying structure of the heat sinks has pore sizes of 300–600 μm and a relative density of ~37%. The black copper oxide that coats the interconnected pores of the thermally conductive copper foam increases emissivity.
Goodfellow
Coraopolis, PA

www.goodfellowusa.com

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