Copper oxide-coated foam heat sink from Goodfellow offers ~37% relative density
Feb. 19, 2016
Microporous copper foam coated with a thin, hard layer of copper oxide serves as a low-profile heat sink in passive cooling environments. The underlying structure of the heat sinks has pore sizes of 300–600 μm and a relative density of ~37%. The black copper oxide that coats the interconnected pores of the thermally conductive copper foam increases emissivity.
Goodfellow
Coraopolis, PA
www.goodfellowusa.com
Sponsored Recommendations
Sponsored Recommendations
How nanopositioning helped achieve fusion ignition
Jan. 31, 2025
Voice your opinion!
Voice your opinion!