Element Six copper diamond composite material: Booth #5110

Jan. 24, 2025

Element Six's copper diamond composite material enables thermal conductivity in the 800 W/mK range, optimized for high-demand applications. It can be manufactured in complex shapes, allowing seamless integration into diverse 2.5/3D advanced packaging configurations. Applications include AI, high-performance computing (HPC), and gallium nitride (GaN) RF devices.

Element Six

Santa Clara, CA

Booth #5110

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