Element Six copper diamond composite material: Booth #5110
Element Six's copper diamond composite material enables thermal conductivity in the 800 W/mK range, optimized for high-demand applications. It can be manufactured in complex shapes, allowing seamless integration into diverse 2.5/3D advanced packaging configurations. Applications include AI, high-performance computing (HPC), and gallium nitride (GaN) RF devices.
Element Six
Santa Clara, CA
Booth #5110