Austin, TX, May 6, 2004--Molecular Imprints, a manufacturer of step and flash imprint lithography (S-FIL) equipment, has announced funding of a $36M joint venture proposal by the National Institute of Standards and Technology - Advanced Technology Program (NIST-ATP) for the development of nano-imprint lithography at key semiconductor roadmap nodes. The other joint venture partners include KLA-Tencor (San Jose, CA), Photronics (Brookfield, CT), Motorola Labs (Schaumburg, IL), and the University of Texas at Austin.
The objective of this proposal is to establish the necessary technology infrastructure associated with the S-FIL process, including system, materials, and template (mask) development. The three-year project will focus on dense contact layers, which are critical in silicon integrated circuit fabrication. The $36M award includes $17.6M from NIST and $19.1M cost sharing from the joint venture participants.
"Molecular Imprints and its joint venture partners are extremely excited to receive this NIST ATP award," said S.V. Sreenivasan, co-founder and CTO of Molecular Imprints. "This significant project will help demonstrate how S-FIL technology can address the demanding silicon CMOS lithography requirements."