Richardson, TX, June 28, 2004--Hymite A/S, which specializes in advanced packaging for optical and MEMS (microelectromechanical systems) components, announced that its small housings for optical components are fully compliant with new common specifications released this month for 10-Gbit/sec Miniature Devices (XMDs). The optical devices include vertical-cavity surface-emitting lasers (VCSELs) and edge emitters.
Hymite uses automated wafer-level technology to achieve smaller package sizes while eliminating much of the labor costs that are still a stumbling block for the optical-component industry. In addition, Hymite uses micromachining to integrate passive components into the package. They are aiming to replace the standard TO cans, butterfly, and DIL configurations that characterize optical packaging today.
Hymite's optical packages comply with the new specifications in all aspects, including electrical terminal assignments and package outline dimensions. The XMD-MSA, or Multi-Source Agreement, was created to enable compatible sources of transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) devices embedded in the 10-Gbit/s XFP MSA module.
"The industry is faced with a major hurdle in reducing packaging costs and form factors," says Jochen Kuhmann, vice president and chief technical officer of Hymite A/S. "Compliance with industry specifications and standards is a key to Hymite's strategy of providing component manufacturers a path to enhanced functionality with further size and cost reductions."
Hymite's small, cost-effective optical subassembly HyShell is based on its patented silicon micromachining process and is available in a ROSA and TOSA version. Both versions can have integrated passives; in addition, the TOSA version can be delivered with an integrated monitor pin. The housing supports full wafer-level assembly and testing, which is a major contributor to cost savings for optical components.
All HyShell packages support existing transmission speeds currently deployed in data-transmission systems and the TOSA versions are applicable for both VCSELs and edge-emitting devices. The HyShell is a low-cost hermetic package that meets the Telcordia specifications GR-468-Core and GR-1221-Core.
