MRSI Systems high-speed die bonder for photonics manufacturing available
The MRSI-HVM3 high-speed die bonder is designed for high-volume photonics manufacturing. The flexible, 3 μm system is equipped with ultrafast-ramp eutectic stations, dual gantries, dual heads, and dual bonding stages, and allows on-the-fly tool changes. Accompanying software lets users change process settings for new parts, processes, and products.
MRSI Systems
Billerica, MA