MRSI Systems high-speed die bonder for photonics manufacturing available

Oct. 6, 2017
The MRSI-HVM3 high-speed die bonder is designed for high-volume photonics manufacturing. 

The MRSI-HVM3 high-speed die bonder is designed for high-volume photonics manufacturing. The flexible, 3 μm system is equipped with ultrafast-ramp eutectic stations, dual gantries, dual heads, and dual bonding stages, and allows on-the-fly tool changes. Accompanying software lets users change process settings for new parts, processes, and products.

MRSI Systems

Billerica, MA

www.mrsisystems.com

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