February 6, 2007, Munich, Germany--Seiko Epson Corp. ("Epson"), leader in printing and imaging products, has purchased an MA200Compact Mask Aligner from SUSS MicroTec, supplier of precision optical manufacturing and test systems, to support its Wafer Level Chip Scale Packaging (W-CSP) production.
After a careful evaluation of competitive systems Epson decided on SUSS' MA200compact Aligner because it demonstrated excellent throughput and a submicron overlay and alignment accuracy. In addition, the MA200Compact has been optimized for advanced thick chemically amplified positive tone resists that allow for ninety degree resist profiles. The system that was purchased during the fourth quarter of 2006 will be delivered to Epson's facility in Japan.
Mask aligners are proximity printing tools where mask and wafer are separated by an exposure gap in the range between 20 and 100 microns. Compared to steppers, where multiple shots may be necessary to expose a full wafer, the mask aligner is able to expose the wafer in one shot, which results in a significant throughput advantage. Proximity aligners offer a low cost lithography solution for high volume production.
Rolf Wolf, managing director of SUSS MicroTec' lithography division, said, "We are pleased that one of the world's most innovative companies in the digital image sector has selected the SUSS MA200Compact to support its Wafer Level Chip Scale Packaging production. SUSS is excited to be participating in the remarkable progress that is currently being made in Wafer Level Packaging manufacturing. This order further solidifies SUSS' position as the leading supplier of production mask aligner systems."
For more information, visit www.suss.com.