Garching and Braunschweig, Germany--SUSS MicroTec and Fraunhofer for Surface Engineering and Thin Films IST have launched a surface-treatment technology useful for fabricating MEMS, optical, and solar devices.
Called Select, technology is used with bond aligners and mask aligners tand selectively activates parts of wafer surfaces using a plasma. Local treatment of the surface prior to wafer processing replaces standard process steps and reduces the overall cost per wafer. Selective plasma activation can be applied to a variety of devices using direct wafer bonding or surface modification for the creation of micromirror arrays, microvalves, sensors, or microfluidic channels.
Conventional surface treatment of complete wafers without selection can damage the functionality of micro-components or electronics. With Fraunhofer IST's selective atmospheric-pressure plasma treatment technology, it is possible to protect those sensitive areas by activating only specific parts of the wafer. Selective plasma activation is used with planar wafers as well as with topographical wafers for which plasma activation is provided either in the cavities or on the elevated structures.
"While selective plasma treatment in wafer-bonding applications significantly reduces the post-bond anneal temperature from 1000°C down to 200°C, it also protects sensitive devices. The technology therefore impressively increases the process window for direct bonding," said Günter Bräuer, the director of Fraunhofer IST.
For more info, see http://www.suss.com/products/mask-aligner/plasma-activation-tookit.html
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