Optoscribe expands 3D component manufacturing capability, doubles headcount
Optoscribe's third-generation laser inscription system delivers 20 times faster throughput than the previous generations.
IMAGE: Optoscribe management include (left-to-right) chief commercial officer Steve McMahon, CEO Nick Psaila, chief operating officer Mark Hesketh, and CFO David Jolliffe.
Optoscribe (Livingston, Scotland) has announced the release of its third-generation ultrahigh-speed 3D photonic component manufacturing system and the expansion of its cleanroom within its Livingston facility. A high-volume, laser-based manufacturer of 3D photonic integrated circuits (PICs), Optoscribe has also increased its headcount by 50% over the past 18 months, having recruited key skills in areas including photonic engineering, product development, and manufacturing.
Optoscribe's new proprietary third-generation laser inscription system delivers 20 times faster throughput than the previous generations, while maintaining the high precision levels required for single-mode components, representing a significant advancement of the company's capabilities. Associated with the expansion of its manufacturing capacity the company has also doubled its Class 1,000 and 10,000 cleanroom areas and installed additional high-speed automated optical device testers.
CEO Nick Psaila said, "Following our last investment round in September 2018, I am delighted to see the continued improvements of our 3D laser inscription technology. "This significant milestone represents the completion of a commitment we made to our investors and our customers to further expand our capability to support increased production volumes going forward. This progress is particularly timely with our ever-increasing levels of commercial engagement in datacentre photonics and other markets."