EOS and Trumpf announce patent license agreement with MCP on laser sintering

Feb. 15, 2008
February 15, 2008, Krailling, Germany--EOS GmbH Electro Optical Systems and Trumpf Werkzeugmaschinen GmbH + Co. KG (Ditzingen, Germany) have signed an agreement with MCP Tooling Technology (Stone, United Kingdom) and MCP-HEK Tooling GmbH in Germany. Under the agreement, both MCP companies receive a non-exclusive license for certain EOS and Trumpf patent rights regarding the laser-sintering process.

February 15, 2008, Krailling, Germany--EOS GmbH Electro Optical Systems and Trumpf Werkzeugmaschinen GmbH + Co. KG (Ditzingen, Germany) have signed an agreement with MCP Tooling Technology (Stone, United Kingdom) and MCP-HEK Tooling GmbH in Germany. Under the agreement, both MCP companies receive a non-exclusive license for certain EOS and Trumpf patent rights regarding the laser-sintering process.

The license does not cover the U.S. and Canada. The parties have agreed not to disclose the level of license fees to be paid by MCP.

Johann Oberhofer, COO and managing director of EOS, said, "This agreement is a further good example of our strategy to license out relevant rights to third parties, if possible and deemed appropriate by us. It enables the parties involved to market their products based on the principles of fair competition, thus complementing the range of our own products. This strategy provides a larger choice for customers and at the same time fosters a faster market growth."

Hans-Joachim Ihde, CEO of MCP / MTT – Group said, "This license agreement will help us to achieve our desired position in the market. It creates a safe and trustful basis for our customers to choose the best and most advanced technology for the specific application. With this agreement, the MCP / MTT – Group is able to strengthen its position considerably, also on a global scale."

For more information, visit www.eos.info.

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