ESI introduces UV laser micromachining system

Aug. 17, 2001
The Model 2700 laser micromachining system from Electro Scientific Industries is designed for dicing wafers and drilling vias in silicon wafers with high accuracy. The dicing capability is specifically aimed at the manufacture of silicon-based array waveguide gratings (AWGs) and microelectromechancial (MEMS) devices.

The Model 2700 laser micromachining system from Electro Scientific Industries is designed for dicing wafers and drilling vias in silicon wafers with high accuracy. The dicing capability is specifically aimed at the manufacture of silicon-based array waveguide gratings (AWGs) and microelectromechancial (MEMS) devices.

The 2700' ability to cut out die with either straight or curved cuts facilitates dicing of AWGs by allowing parts to be nested more closely together, creating more parts per wafer. The system cuts silicon without the use of water, giving it the unique ability to dice released MEMS wafers. In addition, the 2700 is ideal for drilling vias in or through silicon wafers, with the capability of drilling vias 25 microns in diameter through 750 microns thick silicon wafers at the rate of dozens per second.

The firm's patented Compound Beam Positioner enables placement of the laser spot with very high accuracy while traveling at high speeds. The laser beam is positioned using ESI machine vision and vector-based motor control algorithms. Through incremental optical encoders and digital interpolation techniques common to the ESI micromachining platform, the Model 2700 can achieve position resolution of 1 micron. The Model 2700 also includes software that allows micromachining patterns to be directly downloaded from computer automated design (CAD) systems, saving time and improving accuracy.

According to company management, the Model 2700 provides gains in production output through enhanced utilization of wafer real estate. By providing the capability for dicing with significantly reduced street widths, die may be packed more tightly on the wafer, resulting in more parts per wafer. The 2700 allows for smaller streets than other dicing techniques because of its smaller kerf width (less than 35 microns), small damage zone around the cut, and high machine accuracy. Furthermore, the 2700 offers the advantage of being able to cut through outer layers of a structure without chipping, which further increases the yield per wafer.

For more information, visit Electro Scientific Industries.

Sponsored Recommendations

Request a quote: Micro 3D Printed Part or microArch micro-precision 3D printers

April 11, 2024
See the results for yourself! We'll print a benchmark part so that you can assess our quality. Just send us your file and we'll get to work.

Request a Micro 3D Printed Benchmark Part: Send us your file.

April 11, 2024
See the results for yourself! We'll print a benchmark part so that you can assess our quality. Just send us your file and we'll get to work.

Request a free Micro 3D Printed sample part

April 11, 2024
The best way to understand the part quality we can achieve is by seeing it first-hand. Request a free 3D printed high-precision sample part.

How to Tune Servo Systems: The Basics

April 10, 2024
Learn how to tune a servo system using frequency-based tools to meet system specifications by watching our webinar!

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!