Optoscribe begins sampling photonic integrated circuit coupling solution

Sept. 2, 2021
The glass chip overcomes photonic integrated circuit (PIC) coupling challenges to enable high-volume automated assembly and help drive down costs.

3D glass-based integrated photonics components supplier Optoscribe (Livingston, UK) is now sampling its OptoCplrLT monolithic glass chip for low-loss coupling to silicon photonics (SiPh) grating couplers. Created using the company’s high-speed laser writing technique, the glass chip overcomes fiber-to-SiPh photonic integrated circuit (PIC) coupling challenges to enable high-volume automated assembly and help drive down costs.

OptoCplrLT uses low-loss light turning curved mirrors, which are formed in the glass, to direct the light to or from the SiPh grating couplers. This prevents the need for bend-tolerant fiber solutions, which are often expensive, challenging to manufacture, and have some significant limitations in size and profile.

The glass chip has a low-profile interface, ~1 mm device height, and ~1.5 mm with cap, which allows compact interface layouts that alleviate packaging constraints and helps address footprint challenges. It is also compatible with industry-standard materials and processes; for example, it has a coefficient of thermal expansion matched to the silicon chip, helping to maximize performance.

Source: Optoscribe press release

About the Author

LFW Staff

Published since 1965, Laser Focus World—a brand and magazine for engineers, researchers, scientists, and technical professionals—provides comprehensive global coverage of optoelectronic technologies, applications, and markets. With 80,000+ qualified print subscribers in print and over a half-million annual visitors to our online content, we are the go-to source to access decision makers and stay in-the-know.

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!