Optoscribe begins sampling photonic integrated circuit coupling solution
3D glass-based integrated photonics components supplier Optoscribe (Livingston, UK) is now sampling its OptoCplrLT monolithic glass chip for low-loss coupling to silicon photonics (SiPh) grating couplers. Created using the company’s high-speed laser writing technique, the glass chip overcomes fiber-to-SiPh photonic integrated circuit (PIC) coupling challenges to enable high-volume automated assembly and help drive down costs.
OptoCplrLT uses low-loss light turning curved mirrors, which are formed in the glass, to direct the light to or from the SiPh grating couplers. This prevents the need for bend-tolerant fiber solutions, which are often expensive, challenging to manufacture, and have some significant limitations in size and profile.
The glass chip has a low-profile interface, ~1 mm device height, and ~1.5 mm with cap, which allows compact interface layouts that alleviate packaging constraints and helps address footprint challenges. It is also compatible with industry-standard materials and processes; for example, it has a coefficient of thermal expansion matched to the silicon chip, helping to maximize performance.