1-µm die bonder features automatic tool changing function
The MRSI-LEAP high-speed 1-µm die bonder is designed for high-volume manufacturing of artificial intelligence (AI) optical modules, including chip-on-carrier (CoC), chip-on-submount (CoS), and chip-on-board (CoB) assemblies using epoxy processes. It features precision <±1 µm @ 3σ, supports multiple forms of input, an automatic tool changing function, and advanced process options such as flip-chip bonding, UV epoxy dispensing, and in situ UV curing.
MRSI Mycronic
Tewksbury, MA