Die bonder from MRSI Systems provides placement accuracy of

Oct. 10, 2018
The MRSI-H3LD 3 mm high-speed die bonder is optimized for bonding large dies for high-power diode lasers.

The MRSI-H3LD 3 mm high-speed die bonder is optimized for bonding large dies for high-power diode lasers. It achieves high throughput with an auto tool changer on the bonding head and an ultrafast-ramp eutectic station for reduced cycle time. It provides placement accuracy of <3 mm (±3 s).

MRSI Systems

Tewksbury, MA

www.mrsisystems.com

Sponsored Recommendations

March 31, 2025
Enhance your remote sensing capabilities with Chroma's precision-engineered optical filters, designed for applications such as environmental monitoring, geospatial mapping, and...
March 31, 2025
Designed for compatibility with a wide range of systems, Chroma's UV filters are engineered to feature high transmission, superior out-of-band blocking, steep edge transitions...
March 31, 2025
Discover strategies to balance component performance and system design, reducing development time and costs while maximizing efficiency.
March 31, 2025
Explore the essential role of optical filters in enhancing Raman spectroscopy measurements including the various filter types and their applications in improving signal-to-noise...

Voice your opinion!

To join the conversation, and become an exclusive member of Laser Focus World, create an account today!