Die bonder from MRSI Systems provides placement accuracy of
The MRSI-H3LD 3 mm high-speed die bonder is optimized for bonding large dies for high-power diode lasers.
Oct 10th, 2018
The MRSI-H3LD 3 mm high-speed die bonder is optimized for bonding large dies for high-power diode lasers. It achieves high throughput with an auto tool changer on the bonding head and an ultrafast-ramp eutectic station for reduced cycle time. It provides placement accuracy of <3 mm (±3 s).
MRSI Systems
Tewksbury, MA
