Die bonder from MRSI Systems provides placement accuracy of

The MRSI-H3LD 3 mm high-speed die bonder is optimized for bonding large dies for high-power diode lasers. It achieves high throughput with an auto tool changer on the bonding head and an ultrafast-ramp eutectic station for reduced cycle time. It provides placement accuracy of <3 mm (±3 s).

MRSI Systems

Tewksbury, MA

www.mrsisystems.com