Excimer laser debonder from Suss MicroTec performs stress-free debonding of 200 and 300 mm 3D IC wafers

    Nov. 16, 2014
    The ELD300 excimer laser debonder can be used as a stand-alone, semi-automated system or as an integrated process module.
    Content Dam Lfw En Articles 2014 11 Excimer Laser Debonder From Suss Microtec Performs Stress Free Debonding Of 200 And 300 Mm 3d Ic Wafers Leftcolumn Article Thumbnailimage File

    The ELD300 excimer laser debonder performs stress-free debonding of 200 and 300 mm 3D IC wafers. It can be used as a stand-alone, semi-automated system or as an integrated process module in the XBC300 Gen2 platform. The debonding method relies on a 308 nm excimer laser to separate the glass carrier from a tape-mounted thin wafer.
    Suss MicroTec
    Garching, Germany
    www.suss.com

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