Excimer laser debonder from Suss MicroTec performs stress-free debonding of 200 and 300 mm 3D IC wafers
The ELD300 excimer laser debonder performs stress-free debonding of 200 and 300 mm 3D IC wafers. It can be used as a stand-alone, semi-automated system or as an integrated process module in the XBC300 Gen2 platform. The debonding method relies on a 308 nm excimer laser to separate the glass carrier from a tape-mounted thin wafer.
Suss MicroTec
Garching, Germany
www.suss.com
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