OSRAM Opto Semiconductors introduces fine binning for white LEDs

Feb. 14, 2008
February 14, 2008, Santa Clara, CA--OSRAM Opto Semiconductors has announced a new advanced binning process for white LEDs.

February 14, 2008, Santa Clara, CA--OSRAM Opto Semiconductors introduces new, advanced fine binning for white LEDs and delivers significant improvements in off-angle color uniformity as well as a typical color-rendering index (CRI) of 80+. This advanced binning process for white LEDs corresponds to a 3-step McAdams ellipse and is available for Power TOPLED, Advanced Power TOPLED, and the DRAGON family of products.

Lighting applications will benefit from finest white binning in the industry. Lighting applications such as backlighting of diffused surfaces and linear array applications will benefit from the uniform light enabled by this new breakthrough technology, now available in a broad product portfolio, which is fully ANSI/Energy Star-compliant in the U.S.

High color rendering is important for workplace, residential, and retail lighting. OSRAM's improved CRI of 80+ for warm and neutral whites will enhance applications throughout the lighting industry. With OSRAM's new fine white binning, it is now easier and potentially more cost-effective to build lighting applications with the highest requirements in uniformity.

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