Hollis, NH, July 17, 2003. The JPSA ChromaDice UV diode-pumped solid-state (DPSS) Laser system delivers high-speed blue LED wafer scribing with typical yields greater than 99% at less than $2 per wafer. This system cuts a well-defined, square chip, with consistently narrow cuts as small as 5 microns. With its high throughput -- up to 8 wafers per hour -- and minimal impact on LED performance, the process is tolerant of wafer warp and bow; and delivers very fast scribing speed compared to mechanical scribing.
With the ChromaDice, there are no process consumables; one achieves higher yields at lower operating costs, with full automation possible and its attendant higher precision. A single operator can run multiple systems with no impact on process yield. Automatic alignment is rapid, < 1 minute to load and align with the system's patent-pending optical system.
The operating cost of the JPSA ChromaDice system is estimated at less than $2 US per wafer with uptimes easily exceeding 99%, 24/7 maintenance-free operation. Compared to mechanical scribing, the DPSS laser process provides improved wafer throughput by 500%, with a 97.5% reduction in operating costs.
With the ChromaDice, the only consumable is electricity, although periodic laser refurbishment is required; however the cost per wafer is minimal. Narrow cut widths and consistent alignment allow street widths to be reduced, increasing the die count per wafer. The ChromaDice system is operated by the Windows 2000 interface.
UV DPSS laser scribing is poised to replace diamond scribing for die separation on sapphire wafers. 266nm DPSS laser scribing with the ChromaDice represents the state of the art in blue LED die separation.
For more information, visit www.jpsalaser.com .
Laser Focus World